Intel revealed more Lunar Lake processor details with their new Xe2 graphics

Intel has provided more details on the upcoming Lunar Lake processors, which will come with an impressive sounding bump in graphical power. Set to release sometime in Q3 2024.

From what details Intel provided they're claiming "60%" better battery life for these mobile processors in "real-life usages". Impressive if true, but just as exciting is the huge advancement of the graphics side with Xe2 which they claim will bring improved "gaming and graphics performance by 1.5x over the previous generation".

Intel also say you're likely to see "up to 40% lower system-on-chip power compared to the previous generation" as well, which is also mighty impressive there.

Here's an overview:

• Compute Tile – A new compute tile contains the latest-generation Efficient-cores (E-cores) and Performance-cores (P-cores), both of which introduce new microarchitecture enhancements and together bring unprecedented x86 efficiency. Also housed on the compute tile are the new Xe2 graphics processing unit (GPU), neural processing unit (NPU 4) and image processing unit (IPU).
  • Xe2 GPU – Brings more than 80% more gaming performance and more than five times the AI throughput over the previous generation, delivering more than 60 tera-operations per second (TOPS) New microarchitecture for the display and media engines delivers a best-in-class visual experience.
  • NPU 4 – Delivers three times more TOPS over the most recent generation, up to 48 TOPs, to accelerate AI computations with impressively low power.
  • IPU – Provides a great camera experience with reduced power.
• Platform Controller Tile (PCT) – The PCT is where security and connectivity are integrated. Security components deliver a robust integrated security solution with built-in security engines designed to establish a solid foundation for system protection. The upgraded connectivity suite integrates Wi-Fi 7.0, Bluetooth 5.4, PCIe Gen5 and PCIe Gen4 ports, and ThunderboltTM 4 ports.
• Memory on Package – Enables fast access to data and reduces latency, decreasing the overall power consumption of the system.

The "Memory on Package" is quite a big one there. Basically, they've ditched separate RAM as it will be baked into the package itself directly. So you won't be able to upgrade the RAM, you get what it comes with. Hopefully future designs will make use of the exciting LPCAMM2.

More in their press release.